• 10/100 Base-T Ethernet Application
  • Meets IEEE 802.3 & ANSI X 3.263 standards
  • Impedance: 100OHMS
  • Transmit open circuit inductance (OCL): 350uH (MIN) @100KHz
    0.1VRMS with 8mA DC Bias
  • Always EU RoHS/ELV Compliant, wave solder capable to 265°C
  • Rise Time: 2.5nano-seconds from 10 to 90 percent
  • RJ45 jack cavity conforms to FCC rules and regulations Part 68, SUB Part F
  • Industrial Temp: -40ºC to +85ºC
  • Contact Factory for Standard Temp.
Electrical Specifications @ 25°C
Part
Number
OCL(uH Min)
@100KHz/0.1V
with 8mA DC Bias
Turn Ratio
chip: cable
(±2%)
EMI
Fingers
LED
(L/R)
Insertion Loss
(dB Max)
Return Loss
(dB Min)
1-100MHz 1-30MHz 30-60MHz 60-80MHz
AR1009-1326I 350 1CT:1CT YES G/Y 1.0 -18 18-20*LOG(f/30) -12

Electrical Specifications @ 25°C
Part
Number
Cross Talk
(dB Min)
CMRR
(dB Min)
HI-POT
(VDC)
HI-POT
Test
1.0mA/3Sec.
0.5-1MHz 10 MHz 30 MHz 50 MHz 100 MHz 0.3-1MHz 10 MHz 30 MHz 60 MHz 100 MHz
AR1009-1326I -50 -50 -40 -35 -30 -50 -47 -42 -37 -30 2250 1500 Vrms

All specifications subject to change without notice.

MECHANICAL

Unless otherwise specified all tolerances are: ± 0.25 in mm

SCHEMATICS:

Unless Otherwise Specified all tolerances are: ±0.25mm

Notes
  1. R1-R4=75 Ohms, 1/16W, 5% Resisitors.
  2. C1=1000pF, 2KV Decouping Capacitor.
  3. LED Compliant with IEC60825-1 Safety of Laser Products when operated up to 20mA.
  4. LED Forward Voltage: 2.1V(TYP), LED Power Dissipation: 105mW. LED Peak Wavelength: Green=565nm, Yellow=585Nm

PCB LAYOUT

All Dimensions Tolerances Unless Otherwise Specified are: ±0.05mm

Materials and Finish:
Housing: Flammability Rating 94V-O.
Shell: C2680 Brass, 025mm thick, 30+50u” nickel plating.
Mod Jack Contact: Phospher Bronze, 0.35mm thick, Gold Plated.
LED: Diffused Epoxy Lens, 0.5x0.5mm Carbon Steel wireframe leads.